Could TSMC's finalized CHIPS agreement be one of many to come just before a new Trump Administration throws them into doubt?

Siemens introduced AI-enhanced next-generation electronic systems design (ESD) software on Wednesday that combines Xpedition, Hyperlynx and PADS Pro software in a unified user interface backed by ...

Renesas Electronics launched the first SOC for automotive fusion built on the 3nm process, which is designed to improve performance with lower power and save critical space on computer boards for car ...

TDK announced two second-generation MEMS sensors for automotive uses on the eve of the Electronica trade event in Germany on Monday. Both are 6-axis Inertial Measurement Units (IMUs) for advanced ...