The 8.5 µm pixel pitch technology is claimed to be the smallest infrared sensor candidate for future Automatic Emergency Braking (AEB) and Advanced Driver Assistance Systems (ADAS).

Japanese firms Denso and Rohm have announced plans to set up a semiconductor partnership focused on automotive applications. As part of this, Denso will acquire a portion of Rohm's shares.

The $21 billion RF front end (RFFE) industry, initially driven by mobile and infrastructure, is evolving to embrace growth in the automotive market, according to a new Yole Group report 'RF for 4G/5G ...

Based in Tampere, Finland, Vexlum, a supplier of advanced laser devices for quantum technology applications, has ordered the ...

Lumileds has announced the Luxeon 5050 HE Plus, which is claimed to deliver 199 lumens per Watt and 746 lumens of ...

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The latter includes products that play a critical role in the manufacture of compound semiconductors, such as the patented ...

Toshiba Electronics Europe has widened its SiC diode portfolio with ten new 1200V Schottky barrier diodes (SBDs).

It is possible to produce nanowires with a range of materials. They include the group III-nitrides, which offer direct and ...

As this goes hand-in-hand with potentially relaxed fabrication and packaging requirements, the PCSEL makes a compelling case ...

The UK Government has acquired Coherent's GaAs fab in Newton Aycliffe, County Durham, as a crucial supply chain to UK defence ...

QPT, a UK specialist developing next generation GaN-based motor drives, has joined INOPOL, the academic business incubator of ...